Typical Application
電子元器件保護(hù)性密封
Protective sealing of electronic components
特點(diǎn)描述
Description
單組分、易于施工、室溫濕氣固化、耐風(fēng)化、防潮、耐高低溫、防電暈
easy construction, room temperature moisture curing, weathering resistance, moisture resistance, high and low temperature resistance, corona resistance
固化時(shí)間
Typical Cure time
24hours~72hours
顏色
Color
白色
White
